EP3SE260H780C4N vs EP3SE260H780I4L Perbandingan
Perbandingan bersamaan detil EP3SE260H780C4N dari Intel dan EP3SE260H780I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
EP3SE260H780I4L ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE260H780C4N | EP3SE260H780I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Waktu Pembelian Terakhir |
| Family | Stratix III E (Enhanced) | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| Embedded Memory | M9K and M144K blocks | — |
| User I/O Pins | 488 | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| PLLs | 12 | — |
| Process Node | 65 nm CMOS | — |
| Core Voltage | 0.86 V to 1.15 V | 0.9 V |
| Maximum Core Clock Frequency | 450 MHz | — |
| Paket | 780-ball FCBGA (Flip Chip BGA) | — |
| Tipe Mounting | Surface Mount | Surface Mount (flip-chip) |
| Tingkat Sensitivitas Kekeringan (MSL) | 3 (168 hours) | — |
| Suhu Kerja | 0C to +85C (commercial) | Industrial, -40C to +85C |
| Configuration Method | Serial/Parallel via Quartus II | — |
| Total Memory Bits | — | 16,672,640 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| User I/O Count | — | 488 |
| Process Technology | — | 65 nm |
| Package Type | — | 780-pin FC-HFBGA (flip-chip BGA) |
| Number of Transceivers | — | 24 (family-level maximum, per-pin count depends on variant) |
| Max Transceiver Data Rate | — | 6.375 Gbps (Stratix III E family spec) |
| Number of 18x18 Multipliers | — | [DATA_NEEDED: per-package multiplier count] |
| Status RoHS | — | Compliant (lead-free) |
| Configuration Mode | — | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Pin/Package | — | 780-BBGA, FCBGA (flip-chip) |