EP3SE260H780C4N vs EP3SE260H780I4L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C4N sa pamamagitan ng Intel at EP3SE260H780I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260H780C4N EP3SE260H780I4L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Family Stratix III E (Enhanced) Stratix III E (Enhanced)
Logic Elements 255,000 255,000
Logic Array Blocks (LABs) 10,200 —
Total RAM Bits 16,672,768 —
Embedded Memory M9K and M144K blocks —
User I/O Pins 488 —
DSP Blocks (18x18 Multipliers) 768 —
PLLs 12 —
Process Node 65 nm CMOS —
Core Voltage 0.86 V to 1.15 V 0.9 V
Maximum Core Clock Frequency 450 MHz —
Packhaging 780-ball FCBGA (Flip Chip BGA) —
Uri ng Pagpapasok Surface Mount Surface Mount (flip-chip)
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 (168 hours) —
Temperature na Operasyon 0C to +85C (commercial) Industrial, -40C to +85C
Configuration Method Serial/Parallel via Quartus II —
Total Memory Bits — 16,672,640
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
User I/O Count — 488
Process Technology — 65 nm
Package Type — 780-pin FC-HFBGA (flip-chip BGA)
Number of Transceivers — 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate — 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers — [DATA_NEEDED: per-package multiplier count]
Tindminan RoHS — Compliant (lead-free)
Configuration Mode — JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Pin/Package — 780-BBGA, FCBGA (flip-chip)

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