EP3SE260H780C4N vs EP3SE260H780I4L Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780C4N disebabkan oleh Intel dan EP3SE260H780I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE260H780C4N EP3SE260H780I4L
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Family Stratix III E (Enhanced) Stratix III E (Enhanced)
Logic Elements 255,000 255,000
Logic Array Blocks (LABs) 10,200 —
Total RAM Bits 16,672,768 —
Embedded Memory M9K and M144K blocks —
User I/O Pins 488 —
DSP Blocks (18x18 Multipliers) 768 —
PLLs 12 —
Process Node 65 nm CMOS —
Core Voltage 0.86 V to 1.15 V 0.9 V
Maximum Core Clock Frequency 450 MHz —
Kemasan 780-ball FCBGA (Flip Chip BGA) —
Jenis Pemasangan Surface Mount Surface Mount (flip-chip)
Tingkat sensitiviti Air Nama (MSL) 3 (168 hours) —
Suhu Operasi 0C to +85C (commercial) Industrial, -40C to +85C
Configuration Method Serial/Parallel via Quartus II —
Total Memory Bits — 16,672,640
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
User I/O Count — 488
Process Technology — 65 nm
Package Type — 780-pin FC-HFBGA (flip-chip BGA)
Number of Transceivers — 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate — 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers — [DATA_NEEDED: per-package multiplier count]
Status RoHS — Compliant (lead-free)
Configuration Mode — JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Pin/Package — 780-BBGA, FCBGA (flip-chip)

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