EP3SE260H780I3 vs EP3SE260H780C2N Perbandingan

Perbandingan bersamaan detil EP3SE260H780I3 dari Intel dan EP3SE260H780C2N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE260H780I3 EP3SE260H780C2N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Waktu Pembelian Terakhir
Family Stratix III E —
Logic Elements 255,000 255,000
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
LABs/CLBs 10,200 —
Total Memory Bits 16,672,768 —
Embedded 18x18 Multipliers 384 —
User I/Os 488 —
Operating Frequency (logic) 500 MHz —
Operating Frequency (internal max) 800 MHz —
Process Technology 65 nm —
Core Voltage 1.1 V 0.9 V
Paket 780-Ball FC-HFBGA / FCBGA 780-BGA FCBGA
Tipe Mounting Surface Mount Surface Mount
Tingkat Sensitivitas Kekeringan (MSL) 3 (168 Hours) —
Status RoHS Lead Free / Compliant [DATA_NEEDED: rohs status]
Suhu Kerja -40C to +100C (Industrial) —
Series — Stratix III E
LABs / CLBs — 10,200
Total RAM Bits — 16,672,768
User I/O Count — 488
Number of Transceivers — [DATA_NEEDED: transceiver count]
Rentang Suhu Kerja — Commercial (0C to +85C)
Speed Grade — C2
Level MSL — 3 (168 hours)
Reflow Peak Time Max — 40 s
Lead-Free — [DATA_NEEDED: lead-free]
Package Code — BGA
Terminal Form — Ball
Number of Terminals — 780
Process Node — 40 nm

Spek dan Sumber

Buka Semua Produk Buat BOM Ajukan Diskon