EP3SE260H780I4N vs EP3SE260H780C4N Perbandingan
Perbandingan bersamaan detil EP3SE260H780I4N dari Intel dan EP3SE260H780C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260H780I4N | EP3SE260H780C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | NRND |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| User I/Os | 488 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 0.86 V to 1.15 V |
| Maximum Operating Frequency | 450 MHz | — |
| Paket | 780-pin FC-HFBGA (FCBGA) | 780-ball FCBGA (Flip Chip BGA) |
| Package Dimensions | 33 mm x 33 mm | — |
| Ball Pitch | [DATA_NEEDED: BGA ball pitch in mm] | — |
| Suhu Kerja | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Boundary Scan | IEEE Std. 1149.1 (JTAG) | — |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Total RAM Bits | — | 16,672,768 |
| Embedded Memory | — | M9K and M144K blocks |
| User I/O Pins | — | 488 |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm CMOS |
| Maximum Core Clock Frequency | — | 450 MHz |
| Tipe Mounting | — | Surface Mount |
| Tingkat Sensitivitas Kekeringan (MSL) | — | 3 (168 hours) |
| Configuration Method | — | Serial/Parallel via Quartus II |