EP3SE260H780I4N vs EP3SE260H780C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4N sa pamamagitan ng Intel at EP3SE260H780C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP3SE260H780I4N | EP3SE260H780C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| User I/Os | 488 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 0.86 V to 1.15 V |
| Maximum Operating Frequency | 450 MHz | — |
| Packhaging | 780-pin FC-HFBGA (FCBGA) | 780-ball FCBGA (Flip Chip BGA) |
| Package Dimensions | 33 mm x 33 mm | — |
| Ball Pitch | [DATA_NEEDED: BGA ball pitch in mm] | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Boundary Scan | IEEE Std. 1149.1 (JTAG) | — |
| Tindminan RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| Total RAM Bits | — | 16,672,768 |
| Embedded Memory | — | M9K and M144K blocks |
| User I/O Pins | — | 488 |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| PLLs | — | 12 |
| Process Node | — | 65 nm CMOS |
| Maximum Core Clock Frequency | — | 450 MHz |
| Uri ng Pagpapasok | — | Surface Mount |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | — | 3 (168 hours) |
| Configuration Method | — | Serial/Parallel via Quartus II |