EP3SE50F484C3G vs EP3SE50F484C2 Perbandingan
Perbandingan bersamaan detil EP3SE50F484C3G dari Intel dan EP3SE50F484C2 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE50F484C2 - 47.5K LE Stratix III E FPGA | Intel | 484-FCBGA
EP3SE50F484C2 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE50F484C3G | EP3SE50F484C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Waktu Pembelian Terakhir |
| Family | Stratix III E | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | 296 |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Paket | 484-ball FCBGA (F484), 1.0 mm pitch | 484-ball FC-FBGA (FCBGA) |
| Speed Grade | C3 | C2 (commercial, fast) |
| Suhu Kerja | 0C to +85C (commercial, "C") | [DATA_NEEDED: full temp range for C2 suffix] |
| Process Node | 65 nm TSMC low-power | — |
| Core Voltage | 1.1 V | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant (lead-free) | Compliant |
| Logic Elements (LE) | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (M9K + MLAB) | — | 5,760,000 bits |
| Frekuensi Bawah Maximum | — | 600 MHz |
| Process Technology | — | 65 nm |
| Core Supply Voltage | — | 1.1 V |
| Pitch | — | [DATA_NEEDED: ball pitch of FC-FBGA-484] |
| Configuration Interface | — | JTAG / Active Serial (AS) |
| DSP Blocks | — | 18x18 dedicated multipliers |
| Level MSL | — | [DATA_NEEDED: MSL rating] |