EP3SE50F484C3G vs EP3SE50F484C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484C3G sa pamamagitan ng Intel at EP3SE50F484C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE50F484C2 - 47.5K LE Stratix III E FPGA | Intel | 484-FCBGA
EP3SE50F484C2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE50F484C3G | EP3SE50F484C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Stratix III E | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | 296 |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Packhaging | 484-ball FCBGA (F484), 1.0 mm pitch | 484-ball FC-FBGA (FCBGA) |
| Speed Grade | C3 | C2 (commercial, fast) |
| Temperature na Operasyon | 0C to +85C (commercial, "C") | [DATA_NEEDED: full temp range for C2 suffix] |
| Process Node | 65 nm TSMC low-power | — |
| Core Voltage | 1.1 V | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (lead-free) | Compliant |
| Logic Elements (LE) | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (M9K + MLAB) | — | 5,760,000 bits |
| Maksimum na Taktiko ng Oras | — | 600 MHz |
| Process Technology | — | 65 nm |
| Core Supply Voltage | — | 1.1 V |
| Pitch | — | [DATA_NEEDED: ball pitch of FC-FBGA-484] |
| Configuration Interface | — | JTAG / Active Serial (AS) |
| DSP Blocks | — | 18x18 dedicated multipliers |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |