EP3SE50F484I3 vs EP3SE50F484I4 Perbandingan
Perbandingan bersamaan detil EP3SE50F484I3 dari Intel dan EP3SE50F484I4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE50F484I3 | EP3SE50F484I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory | 5,760 Kbits | — |
| User I/Os | 296 | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 1.1 V | 1.1 V |
| Paket | 484-ball FCBGA (FineLine BGA), 1.0 mm pitch | 484-ball FC-FBGA |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) | — |
| Speed Grade | I3 (-3 speed bin, industrial) | — |
| DSP Blocks | Yes (embedded multipliers and accumulators) | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| PLLs | Yes (multiple, for clock management) | — |
| I/O Standards | LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X | — |
| Transceivers | Multi-gigabit transceivers supported | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 47,500 |
| Logic Array Blocks (LAB) | — | 1,900 |
| Maximum User I/O | — | 296 |
| Embedded Memory (Bits) | — | 5,760,000 |
| DSP Blocks (18x18 Multipliers) | — | 216 |
| Maximum Operating Frequency | — | 450 MHz |
| Package Code | — | BBGA / FC-FBGA |
| Temperature / Speed Grade | — | I4 (Industrial) |
| Suhu Hubung Kerja | — | -40 C to +100 C |