EP3SE50F484I3 vs EP3SL50F484I3 Perbandingan

Perbandingan bersamaan detil EP3SE50F484I3 dari Intel dan EP3SL50F484I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE50F484I3 EP3SL50F484I3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Family Stratix III E Stratix III L (Low Power)
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory 5,760 Kbits —
User I/Os 296 —
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 1.1 V
Paket 484-ball FCBGA (FineLine BGA), 1.0 mm pitch 484-ball FC-FBGA (Flip-Chip FineLine BGA)
Operating Temperature Grade Industrial (-40 °C to +100 °C) —
Speed Grade I3 (-3 speed bin, industrial) —
DSP Blocks Yes (embedded multipliers and accumulators) —
Configuration Modes AS, PS, FPP, JTAG —
PLLs Yes (multiple, for clock management) —
I/O Standards LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X —
Transceivers Multi-gigabit transceivers supported Stratix III L — supports high-speed serial transceivers per family datasheet
Tipe Mounting Surface Mount (BGA) Surface Mount
Status RoHS Compliant —
Lead-Free Yes —
Device Logic Elements — 47,500
Embedded Memory (bits) — 2,184,192
Maximum User I/O — 296
Internal Operating Frequency — 500 MHz
Suhu Kerja — 0 °C to +85 °C (commercial)
Lead-Free / RoHS — [DATA_NEEDED: lead-free/RoHS status]
Level MSL — [DATA_NEEDED: MSL level]
Configuration Scheme — SRAM-based (volatile, requires external config device)

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