EP3SE50F484I3 vs EP3SL50F484I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F484I3 sa pamamagitan ng Intel at EP3SL50F484I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE50F484I3 EP3SL50F484I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Family Stratix III E Stratix III L (Low Power)
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory 5,760 Kbits —
User I/Os 296 —
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 1.1 V
Packhaging 484-ball FCBGA (FineLine BGA), 1.0 mm pitch 484-ball FC-FBGA (Flip-Chip FineLine BGA)
Operating Temperature Grade Industrial (-40 °C to +100 °C) —
Speed Grade I3 (-3 speed bin, industrial) —
DSP Blocks Yes (embedded multipliers and accumulators) —
Configuration Modes AS, PS, FPP, JTAG —
PLLs Yes (multiple, for clock management) —
I/O Standards LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X —
Transceivers Multi-gigabit transceivers supported Stratix III L — supports high-speed serial transceivers per family datasheet
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Tindminan RoHS Compliant —
Lead-Free Yes —
Device Logic Elements — 47,500
Embedded Memory (bits) — 2,184,192
Maximum User I/O — 296
Internal Operating Frequency — 500 MHz
Temperature na Operasyon — 0 °C to +85 °C (commercial)
Lead-Free / RoHS — [DATA_NEEDED: lead-free/RoHS status]
Level ng MSL — [DATA_NEEDED: MSL level]
Configuration Scheme — SRAM-based (volatile, requires external config device)

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