EP3SE50F484I3 vs EP3SL50F484I3 比較

詳細並排比較 EP3SE50F484I3 由 Intel 與 EP3SL50F484I3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F484I3 EP3SL50F484I3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III E Stratix III L (Low Power)
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory 5,760 Kbits —
User I/Os 296 —
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 1.1 V
封裝 484-ball FCBGA (FineLine BGA), 1.0 mm pitch 484-ball FC-FBGA (Flip-Chip FineLine BGA)
Operating Temperature Grade Industrial (-40 °C to +100 °C) —
Speed Grade I3 (-3 speed bin, industrial) —
DSP Blocks Yes (embedded multipliers and accumulators) —
Configuration Modes AS, PS, FPP, JTAG —
PLLs Yes (multiple, for clock management) —
I/O Standards LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X —
Transceivers Multi-gigabit transceivers supported Stratix III L — supports high-speed serial transceivers per family datasheet
安裝類型 Surface Mount (BGA) Surface Mount
RoHS 狀態 Compliant —
Lead-Free Yes —
Device Logic Elements — 47,500
Embedded Memory (bits) — 2,184,192
Maximum User I/O — 296
Internal Operating Frequency — 500 MHz
工作溫度 — 0 °C to +85 °C (commercial)
Lead-Free / RoHS — [DATA_NEEDED: lead-free/RoHS status]
MSL 等級 — [DATA_NEEDED: MSL level]
Configuration Scheme — SRAM-based (volatile, requires external config device)

資料表與資源

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