EP3SE50F484I4L vs EP3SE50F484I4G Perbandingan

Perbandingan bersamaan detil EP3SE50F484I4L dari Intel dan EP3SE50F484I4G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE50F484I4L EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE50F484I4L EP3SE50F484I4G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir NRND
Family Stratix III E Stratix III E
Logic Elements (LE) 47,500 —
Logic Array Blocks (LABs) 1,900 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] 19,000 ALM
Embedded Memory 5,760 Kbit (5.625 Mbit) 5.49 Mbit
Embedded Multipliers (18x18) 384 —
Maximum User I/O 296 —
Maximum Core Clock 717 MHz (per third-party listing) —
Speed Grade 4 (slowest) 4
Rentang Suhu Kerja Industrial (I): -40C to +100C junction —
Process Node 40 nm CMOS —
Paket 484-ball FCBGA (FBGA-484) 484-Ball FCBGA (FineLine BGA)
Tipe Mounting Surface Mount (BGA) —
Tegangan Pemuat Multiple rails: core 0.9V, I/O 1.2V-3.3V (per Stratix III handbook) —
Configuration Method Quartus II / EPCS serial / parallel —
Lead-Free (Pb-free) Yes (L suffix) —
Status RoHS Compliant Compliant (lead-free 'G' suffix)
Level MSL MSL3 (per JEDEC J-STD-020, typical for FBGA-484) [DATA_NEEDED: MSL level]
Logic Elements — 47,500 LE
User I/Os — 296 I/O
Tegangan Pemuat Kerja — 1.1 V (core)
Suhu Kerja — -40C to +100C (industrial)
Gaya Mounting — SMD/SMT
Process Technology — 40 nm low-power CMOS
Transceiver Count — Up to 12 (Stratix III E family)
External Memory Support — DDR3, DDR2, QDR II/II+

Spek dan Sumber

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