EP3SE50F484I4L vs EP3SE50F484I4LG Perbandingan
Perbandingan bersamaan detil EP3SE50F484I4L dari Intel dan EP3SE50F484I4LG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
EP3SE50F484I4L ⚠ Waktu Beli TerakhirIntel
EP3SE50F484I4LG - 47.5K LE Stratix III E FPGA, 484-FCBGA | Intel
EP3SE50F484I4LG ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE50F484I4L | EP3SE50F484I4LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Family | Stratix III E | Stratix III (Enhanced) |
| Logic Elements (LE) | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 19,000 |
| Embedded Memory | 5,760 Kbit (5.625 Mbit) | — |
| Embedded Multipliers (18x18) | 384 | — |
| Maximum User I/O | 296 | — |
| Maximum Core Clock | 717 MHz (per third-party listing) | — |
| Speed Grade | 4 (slowest) | — |
| Rentang Suhu Kerja | Industrial (I): -40C to +100C junction | -40C to +100C (Industrial, TJ) |
| Process Node | 40 nm CMOS | — |
| Paket | 484-ball FCBGA (FBGA-484) | 484-ball FBGA / FCBGA |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (SMD/SMT) |
| Tegangan Pemuat | Multiple rails: core 0.9V, I/O 1.2V-3.3V (per Stratix III handbook) | — |
| Configuration Method | Quartus II / EPCS serial / parallel | — |
| Lead-Free (Pb-free) | Yes (L suffix) | — |
| Status RoHS | Compliant | Compliant |
| Level MSL | MSL3 (per JEDEC J-STD-020, typical for FBGA-484) | — |
| Series | — | Stratix III E |
| LABs/CLBs | — | 1,900 |
| Total Embedded Memory | — | 5,760,000 bits (5.49 Mbit / 5.76 Mbit per source) |
| Number of DSP Blocks | — | 104 (18x18 multipliers) |
| Number of PLLs | — | 8 |
| User I/O Count | — | 296 |
| Core Supply Voltage (Vccint) | — | 0.86 V to 1.15 V (1.1 V nominal) |
| Packaging | — | Tray |
| Process Technology | — | 40 nm CMOS |
| Configuration Interface | — | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | — | 256-bit AES |