EP3SE50F780C3 vs EP3SE50F780C4L Perbandingan
Perbandingan bersamaan detil EP3SE50F780C3 dari Intel dan EP3SE50F780C4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE50F780C3 | EP3SE50F780C4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III |
| Logic Elements (LE) | 47,500 | 47,500 |
| Embedded Memory (BRAM) | 5,760 Kbits | — |
| User I/Os | 488 | 488 |
| Paket | 780-ball FC-FBGA (FineLine BGA) | 780-ball FCBGA (Flip-Chip BGA) |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 1.1 V |
| Logic Voltage | 0.9 V | — |
| Transceiver Speed (max) | 500 MHz | — |
| Total LABs/CLBs | 1900 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Tipe Mounting | Surface Mount (BGA) | — |
| Suhu Kerja | 0C to +85C (Commercial grade, 'C' suffix) | [DATA_NEEDED: full industrial/commercial grade] |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free) |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Series | — | Stratix III E |
| Embedded Memory | — | 5,760,000 bits |
| DSP Blocks (18x18 multipliers) | — | 304 (19x16) |
| Process Node | — | 40 nm |
| Speed Grade | — | C4 (commercial, speed 4) |
| Lead-Free (L suffix) | — | Yes |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| Transceivers | — | [DATA_NEEDED: per Stratix III E variant] |
| PLLs | — | [DATA_NEEDED: PLL count] |