EP3SE50F780C3 vs EP3SE50F780C4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C3 sa pamamagitan ng Intel at EP3SE50F780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE50F780C3 | EP3SE50F780C4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III |
| Logic Elements (LE) | 47,500 | 47,500 |
| Embedded Memory (BRAM) | 5,760 Kbits | — |
| User I/Os | 488 | 488 |
| Packhaging | 780-ball FC-FBGA (FineLine BGA) | 780-ball FCBGA (Flip-Chip BGA) |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 1.1 V |
| Logic Voltage | 0.9 V | — |
| Transceiver Speed (max) | 500 MHz | — |
| Total LABs/CLBs | 1900 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Temperature na Operasyon | 0C to +85C (Commercial grade, 'C' suffix) | [DATA_NEEDED: full industrial/commercial grade] |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Series | — | Stratix III E |
| Embedded Memory | — | 5,760,000 bits |
| DSP Blocks (18x18 multipliers) | — | 304 (19x16) |
| Process Node | — | 40 nm |
| Speed Grade | — | C4 (commercial, speed 4) |
| Lead-Free (L suffix) | — | Yes |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / Enhanced |
| Transceivers | — | [DATA_NEEDED: per Stratix III E variant] |
| PLLs | — | [DATA_NEEDED: PLL count] |