EP3SE50F780I4G vs EP3SE50F780I3G Perbandingan
Perbandingan bersamaan detil EP3SE50F780I4G dari Intel dan EP3SE50F780I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE50F780I4G | EP3SE50F780I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 LE | — |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 5,760,000 bit (5.49 Mbit) | 8.7 Mbits (M9K + M144K blocks) |
| Maximum User I/Os | 488 I/O | — |
| Paket | 780-ball FBGA (FCBGA) | 780-pin FC-FBGA (F780) 29x29 mm |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Operating Supply Voltage (Core) | 1.1 V | — |
| Rentang Suhu Kerja | -40C to +100C (Industrial) | — |
| Speed Grade | I4 | 3 |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LABs count] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 264 (18x18 multipliers) |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | 12 channels, up to 3.75 Gbps |
| Configuration Method | JTAG, Passive Serial, FPP, Active Serial | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements (LE) | — | 47,500 |
| Adaptive Logic Modules (ALM) | — | 19,000 |
| Maximum User I/O Pins | — | 488 |
| Core Voltage | — | 1.1 V |
| Process Technology | — | TSMC 40 nm |
| Suhu Kerja | — | -40C to +100C (Industrial, I3) |
| Memory Interfaces | — | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM |
| PCI Express Hard IP | — | Gen1 x1/x4/x8 |
| Level MSL | — | 3 |