EP3SE50F780I4G vs EP3SE50F780I3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F780I4G disebabkan oleh Intel dan EP3SE50F780I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE50F780I4G | EP3SE50F780I3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 LE | — |
| Adaptive Logic Modules (ALMs) | 19,000 ALM | — |
| Embedded Memory | 5,760,000 bit (5.49 Mbit) | 8.7 Mbits (M9K + M144K blocks) |
| Maximum User I/Os | 488 I/O | — |
| Kemasan | 780-ball FBGA (FCBGA) | 780-pin FC-FBGA (F780) 29x29 mm |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Operating Supply Voltage (Core) | 1.1 V | — |
| Gambaran Suhu Operasi | -40C to +100C (Industrial) | — |
| Speed Grade | I4 | 3 |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LABs count] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 264 (18x18 multipliers) |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | 12 channels, up to 3.75 Gbps |
| Configuration Method | JTAG, Passive Serial, FPP, Active Serial | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements (LE) | — | 47,500 |
| Adaptive Logic Modules (ALM) | — | 19,000 |
| Maximum User I/O Pins | — | 488 |
| Core Voltage | — | 1.1 V |
| Process Technology | — | TSMC 40 nm |
| Suhu Operasi | — | -40C to +100C (Industrial, I3) |
| Memory Interfaces | — | DDR3 up to 800 MHz, DDR2, QDR II+ SRAM |
| PCI Express Hard IP | — | Gen1 x1/x4/x8 |
| Aras MSL | — | 3 |