EP3SE80F780C2N vs EP3SE110F780C4N Perbandingan
Perbandingan bersamaan detil EP3SE80F780C2N dari Intel dan EP3SE110F780C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE80F780C2N | EP3SE110F780C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III |
| Logic Elements (LE) | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | — |
| Embedded Memory | 6,843,392 bits | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Auxiliary Voltage (VCCAUX) | 0.9 V | — |
| Paket | 780-Ball FC-FBGA | — |
| Package Code | F780 | BGA |
| Speed Grade | C2 | C4 |
| Maximum Operating Frequency | 600 MHz | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Series | — | Stratix III E |
| Logic Elements (LEs) | — | 107500 |
| Embedded Memory Bits | — | 8936448 |
| User I/O Count | — | 488 |
| Number of Terminals | — | 780 |
| Package Type | — | 780-BBGA, FCBGA |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Suhu Kerja | — | 0C to 85C (Commercial) |
| Process Node | — | 65 nm |
| Configuration Mode | — | PS / FPP / JTAG |