EP3SE80F780C2N vs EP3SE110F780C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F780C2N sa pamamagitan ng Intel at EP3SE110F780C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE80F780C2N | EP3SE110F780C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III |
| Logic Elements (LE) | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | — |
| Embedded Memory | 6,843,392 bits | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Auxiliary Voltage (VCCAUX) | 0.9 V | — |
| Packhaging | 780-Ball FC-FBGA | — |
| Package Code | F780 | BGA |
| Speed Grade | C2 | C4 |
| Maximum Operating Frequency | 600 MHz | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Stratix III E |
| Logic Elements (LEs) | — | 107500 |
| Embedded Memory Bits | — | 8936448 |
| User I/O Count | — | 488 |
| Number of Terminals | — | 780 |
| Package Type | — | 780-BBGA, FCBGA |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Temperature na Operasyon | — | 0C to 85C (Commercial) |
| Process Node | — | 65 nm |
| Configuration Mode | — | PS / FPP / JTAG |