EP3SE80F780C2N vs EP3SE110F780C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE80F780C2N disebabkan oleh Intel dan EP3SE110F780C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE80F780C2N | EP3SE110F780C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III |
| Logic Elements (LE) | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | — |
| Embedded Memory | 6,843,392 bits | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Auxiliary Voltage (VCCAUX) | 0.9 V | — |
| Kemasan | 780-Ball FC-FBGA | — |
| Package Code | F780 | BGA |
| Speed Grade | C2 | C4 |
| Maximum Operating Frequency | 600 MHz | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Series | — | Stratix III E |
| Logic Elements (LEs) | — | 107500 |
| Embedded Memory Bits | — | 8936448 |
| User I/O Count | — | 488 |
| Number of Terminals | — | 780 |
| Package Type | — | 780-BBGA, FCBGA |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Suhu Operasi | — | 0C to 85C (Commercial) |
| Process Node | — | 65 nm |
| Configuration Mode | — | PS / FPP / JTAG |