EP3SE80F780C2N vs EP3SE110F780C4N 比較
詳細並排比較 EP3SE80F780C2N 由 Intel 與 EP3SE110F780C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE80F780C2N | EP3SE110F780C4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Family | Stratix III E | Stratix III |
| Logic Elements (LE) | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | — |
| Embedded Memory | 6,843,392 bits | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Auxiliary Voltage (VCCAUX) | 0.9 V | — |
| 封裝 | 780-Ball FC-FBGA | — |
| Package Code | F780 | BGA |
| Speed Grade | C2 | C4 |
| Maximum Operating Frequency | 600 MHz | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | Compliant | Compliant |
| Series | — | Stratix III E |
| Logic Elements (LEs) | — | 107500 |
| Embedded Memory Bits | — | 8936448 |
| User I/O Count | — | 488 |
| Number of Terminals | — | 780 |
| Package Type | — | 780-BBGA, FCBGA |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| 工作溫度 | — | 0C to 85C (Commercial) |
| Process Node | — | 65 nm |
| Configuration Mode | — | PS / FPP / JTAG |