EP3SL200H780C3N vs EP3SL200H780C4L Perbandingan
Perbandingan bersamaan detil EP3SL200H780C3N dari Intel dan EP3SL200H780C4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780C3N | EP3SL200H780C4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix III L (low-power) | — |
| Process Node | 40 nm | — |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory Bits | 10,901,504 bits | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/Os | 488 | — |
| Paket | 780-Ball FCBGA (HBGA), 29 x 29 mm | — |
| Tipe Mounting | Surface Mount | — |
| Maximum Internal Clock Frequency | 800 MHz | — |
| Transceivers | 24 channels, up to 3.75 Gbps | — |
| DSP Blocks | 384 | — |
| Speed Grade | C3 (commercial, -3 speed) | -4 (medium performance, commercial) |
| Suhu Kerja | 0C to +85C (commercial) | 0C to 85C (commercial) |
| Voltage - Core | 0.9 V / 1.0 V (core, VCC) | — |
| Voltage - I/O | 1.2 V to 3.3 V (VCCIO banks) | — |
| Level MSL | 3 | — |
| Lead-Free / RoHS | Yes | — |
| Mounting Pitch | 1.0 mm ball pitch | — |
| PLLs | 12 (Stratix III PLL array) | — |
| Configuration | JTAG IEEE Std 1149.1, passive/active serial | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix III |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Embedded Memory | — | 6.5 Mbit |
| User I/O Count | — | 488 |
| Package Type | — | 780-ball FCBGA (FineLine BGA, HBGA) |
| Package Code | — | BGA-780 / PBGA780 / HBGA-780 |
| Package Mounting | — | Surface Mount |
| Internal Logic Frequency | — | up to 717 MHz (per ampheo datasheet brief) |
| Lead-Free / Pb-Free | — | Yes (L suffix, lead-free) |
| Status RoHS | — | Compliant |
| Process Technology | — | TSMC 40 nm |
| Configuration Modes | — | FPP, AS, PS, JTAG |