EP3SL200H780C3N vs EP3SL200H780C4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780C3N disebabkan oleh Intel dan EP3SL200H780C4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL200H780C3N | EP3SL200H780C4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix III L (low-power) | — |
| Process Node | 40 nm | — |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory Bits | 10,901,504 bits | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/Os | 488 | — |
| Kemasan | 780-Ball FCBGA (HBGA), 29 x 29 mm | — |
| Jenis Pemasangan | Surface Mount | — |
| Maximum Internal Clock Frequency | 800 MHz | — |
| Transceivers | 24 channels, up to 3.75 Gbps | — |
| DSP Blocks | 384 | — |
| Speed Grade | C3 (commercial, -3 speed) | -4 (medium performance, commercial) |
| Suhu Operasi | 0C to +85C (commercial) | 0C to 85C (commercial) |
| Voltage - Core | 0.9 V / 1.0 V (core, VCC) | — |
| Voltage - I/O | 1.2 V to 3.3 V (VCCIO banks) | — |
| Aras MSL | 3 | — |
| Lead-Free / RoHS | Yes | — |
| Mounting Pitch | 1.0 mm ball pitch | — |
| PLLs | 12 (Stratix III PLL array) | — |
| Configuration | JTAG IEEE Std 1149.1, passive/active serial | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix III |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Embedded Memory | — | 6.5 Mbit |
| User I/O Count | — | 488 |
| Package Type | — | 780-ball FCBGA (FineLine BGA, HBGA) |
| Package Code | — | BGA-780 / PBGA780 / HBGA-780 |
| Package Mounting | — | Surface Mount |
| Internal Logic Frequency | — | up to 717 MHz (per ampheo datasheet brief) |
| Lead-Free / Pb-Free | — | Yes (L suffix, lead-free) |
| Status RoHS | — | Compliant |
| Process Technology | — | TSMC 40 nm |
| Configuration Modes | — | FPP, AS, PS, JTAG |