EP3SL200H780C3N vs EP3SL200H780C4L 比較

詳細並排比較 EP3SL200H780C3N 由 Intel 與 EP3SL200H780C4L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SL200H780C3N EP3SL200H780C4L
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 啟用中
Family Stratix III L (low-power) —
Process Node 40 nm —
Logic Elements 200,000 200,000
Embedded Memory Bits 10,901,504 bits —
Logic Array Blocks (LABs) 8,000 —
User I/Os 488 —
封裝 780-Ball FCBGA (HBGA), 29 x 29 mm —
安裝類型 Surface Mount —
Maximum Internal Clock Frequency 800 MHz —
Transceivers 24 channels, up to 3.75 Gbps —
DSP Blocks 384 —
Speed Grade C3 (commercial, -3 speed) -4 (medium performance, commercial)
工作溫度 0C to +85C (commercial) 0C to 85C (commercial)
Voltage - Core 0.9 V / 1.0 V (core, VCC) —
Voltage - I/O 1.2 V to 3.3 V (VCCIO banks) —
MSL 等級 3 —
Lead-Free / RoHS Yes —
Mounting Pitch 1.0 mm ball pitch —
PLLs 12 (Stratix III PLL array) —
Configuration JTAG IEEE Std 1149.1, passive/active serial —
Manufacturer — Intel (formerly Altera)
Series — Stratix III
Device Type — FPGA - Field Programmable Gate Array
Embedded Memory — 6.5 Mbit
User I/O Count — 488
Package Type — 780-ball FCBGA (FineLine BGA, HBGA)
Package Code — BGA-780 / PBGA780 / HBGA-780
Package Mounting — Surface Mount
Internal Logic Frequency — up to 717 MHz (per ampheo datasheet brief)
Lead-Free / Pb-Free — Yes (L suffix, lead-free)
RoHS 狀態 — Compliant
Process Technology — TSMC 40 nm
Configuration Modes — FPP, AS, PS, JTAG

資料表與資源

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