EP3SL200H780C3N vs EP3SL200H780I3 Perbandingan
Perbandingan bersamaan detil EP3SL200H780C3N dari Intel dan EP3SL200H780I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780C3N | EP3SL200H780I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III L (low-power) | Stratix III |
| Process Node | 40 nm | — |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory Bits | 10,901,504 bits | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/Os | 488 | — |
| Paket | 780-Ball FCBGA (HBGA), 29 x 29 mm | 780-BBGA, FCBGA (HBGA-780) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Maximum Internal Clock Frequency | 800 MHz | — |
| Transceivers | 24 channels, up to 3.75 Gbps | — |
| DSP Blocks | 384 | — |
| Speed Grade | C3 (commercial, -3 speed) | — |
| Suhu Kerja | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Voltage - Core | 0.9 V / 1.0 V (core, VCC) | — |
| Voltage - I/O | 1.2 V to 3.3 V (VCCIO banks) | — |
| Level MSL | 3 | — |
| Lead-Free / RoHS | Yes | Compliant (lead-free) |
| Mounting Pitch | 1.0 mm ball pitch | — |
| PLLs | 12 (Stratix III PLL array) | 12 |
| Configuration | JTAG IEEE Std 1149.1, passive/active serial | — |
| Series | — | Stratix III L |
| LABs (Logic Array Blocks) | — | 8000 |
| Total RAM Bits | — | 10,901,504 (10,900 Kb) |
| User I/O Count | — | 488 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O banks] |
| Embedded Multipliers (DSP blocks) | — | 384 (18x18) |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 717 MHz |
| Supplier Device Package | — | 780-FBGA (29x29 mm) |