EP3SL200H780C3N vs EP3SL200H780I3 Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP3SL200H780C3N tarafından Intel ve EP3SL200H780I3 tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP3SL200H780C3N | EP3SL200H780I3 |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | NRND | NRND |
| Family | Stratix III L (low-power) | Stratix III |
| Process Node | 40 nm | — |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory Bits | 10,901,504 bits | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/Os | 488 | — |
| Paket | 780-Ball FCBGA (HBGA), 29 x 29 mm | 780-BBGA, FCBGA (HBGA-780) |
| Montaj Türü | Surface Mount | Surface Mount |
| Maximum Internal Clock Frequency | 800 MHz | — |
| Transceivers | 24 channels, up to 3.75 Gbps | — |
| DSP Blocks | 384 | — |
| Speed Grade | C3 (commercial, -3 speed) | — |
| İşletim Sıcaklığı | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Voltage - Core | 0.9 V / 1.0 V (core, VCC) | — |
| Voltage - I/O | 1.2 V to 3.3 V (VCCIO banks) | — |
| MSL Seviyesi | 3 | — |
| Lead-Free / RoHS | Yes | Compliant (lead-free) |
| Mounting Pitch | 1.0 mm ball pitch | — |
| PLLs | 12 (Stratix III PLL array) | 12 |
| Configuration | JTAG IEEE Std 1149.1, passive/active serial | — |
| Series | — | Stratix III L |
| LABs (Logic Array Blocks) | — | 8000 |
| Total RAM Bits | — | 10,901,504 (10,900 Kb) |
| User I/O Count | — | 488 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O banks] |
| Embedded Multipliers (DSP blocks) | — | 384 (18x18) |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 717 MHz |
| Supplier Device Package | — | 780-FBGA (29x29 mm) |