EP3SL200H780C3N vs EP3SL200H780I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780C3N disebabkan oleh Intel dan EP3SL200H780I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL200H780C3N | EP3SL200H780I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III L (low-power) | Stratix III |
| Process Node | 40 nm | — |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory Bits | 10,901,504 bits | — |
| Logic Array Blocks (LABs) | 8,000 | — |
| User I/Os | 488 | — |
| Kemasan | 780-Ball FCBGA (HBGA), 29 x 29 mm | 780-BBGA, FCBGA (HBGA-780) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Maximum Internal Clock Frequency | 800 MHz | — |
| Transceivers | 24 channels, up to 3.75 Gbps | — |
| DSP Blocks | 384 | — |
| Speed Grade | C3 (commercial, -3 speed) | — |
| Suhu Operasi | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Voltage - Core | 0.9 V / 1.0 V (core, VCC) | — |
| Voltage - I/O | 1.2 V to 3.3 V (VCCIO banks) | — |
| Aras MSL | 3 | — |
| Lead-Free / RoHS | Yes | Compliant (lead-free) |
| Mounting Pitch | 1.0 mm ball pitch | — |
| PLLs | 12 (Stratix III PLL array) | 12 |
| Configuration | JTAG IEEE Std 1149.1, passive/active serial | — |
| Series | — | Stratix III L |
| LABs (Logic Array Blocks) | — | 8000 |
| Total RAM Bits | — | 10,901,504 (10,900 Kb) |
| User I/O Count | — | 488 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O banks] |
| Embedded Multipliers (DSP blocks) | — | 384 (18x18) |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 717 MHz |
| Supplier Device Package | — | 780-FBGA (29x29 mm) |