EP3SL200H780I3 vs EP3SL200H780I4L Perbandingan

Perbandingan bersamaan detil EP3SL200H780I3 dari Intel dan EP3SL200H780I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SL200H780I3 EP3SL200H780I4L
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Series Stratix III L —
Family Stratix III Stratix III L
Logic Elements 200,000 200,000
LABs (Logic Array Blocks) 8000 —
Total RAM Bits 10,901,504 (10,900 Kb) —
User I/O Count 488 —
Number of I/O Banks [DATA_NEEDED: I/O banks] —
Embedded Multipliers (DSP blocks) 384 (18x18) —
PLLs 12 —
Process Technology 65 nm CMOS 65 nm CMOS
Core Voltage 1.1 V —
Maximum Operating Frequency 717 MHz —
Suhu Kerja -40C to +100C (Industrial) -40C to +100C (Industrial)
Paket 780-BBGA, FCBGA (HBGA-780) 780-pin FC-HFBGA (Flip-Chip)
Tipe Mounting Surface Mount Surface Mount
Supplier Device Package 780-FBGA (29x29 mm) —
Lead-Free / RoHS Compliant (lead-free) —
Logic Array Blocks (LABs) — 8,000
Embedded Memory (Bits) — 10,901,504
Maximum User I/O — 488
Core Supply Voltage — 0.86 V to 1.15 V
Internal Performance — 375 MHz
Transceivers — Up to 24 channels
Transceiver Data Rate — Up to 6.375 Gbps
DSP Blocks — 9x9 / 18x18 / 36x36 multipliers
Memory Interface Support — DDR3, DDR2, DDR, QDR II+, RLDRAM II
JTAG Support — IEEE Std 1149.1 Boundary-Scan
Status RoHS — Compliant
Speed Grade — I4 (Industrial)
HardCopy Support — Compatible (Lattice-style migration path via HardCopy III)

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