EP3SL50F484C4LG vs EP3SE50F484C4LG Perbandingan
Perbandingan bersamaan detil EP3SL50F484C4LG dari Intel dan EP3SE50F484C4LG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL50F484C4LG | EP3SE50F484C4LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | Stratix III L | — |
| Family | FPGA - Field Programmable Gate Array | Stratix® III E |
| Number of Logic Elements (LE) | 47500 | — |
| Number of LABs/CLBs | 1900 | — |
| Adaptive Logic Modules (ALM) | 19000 ALM | — |
| Total Embedded Memory | 2184192 bit (2.08 Mbit) | — |
| Number of I/O | 296 | — |
| Tegangan Pemuat | 0.86 V to 1.15 V (1.1 V typical) | — |
| Suhu Kerja | 0 C to +85 C (TJ) | — |
| Gaya Mounting | SMD/SMT | — |
| Paket | 484-FBGA (23x23 mm) | 484-Ball FCBGA, 23 x 23 mm |
| Paket / Case | 484-BBGA, FCBGA | — |
| Packaging | Tray | — |
| Supplier Device Package | 484-FBGA | — |
| Status RoHS | Compliant | — |
| Speed Grade | C4 (commercial, slowest) | -4 |
| Process Node | 40 nm | 40 nm TSMC |
| Logic Elements | — | 47,500 LE |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Embedded Memory | — | 5.49 Mbit (2,886 Kbit M9K + M144K blocks) |
| Maximum User I/O | — | 296 |
| Hardware Multipliers (18x18) | — | 384 |
| PLLs | — | 4 |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Rentang Suhu Kerja | — | 0°C to +85°C (Commercial) |
| Tipe Mounting | — | Surface Mount |
| Lead-Free / RoHS | — | Yes (lead-free finish, RoHS compliant) |
| Level MSL | — | 3 (per JEDEC J-STD-020) |
| Design Software | — | Quartus II 11.0 or later |