EP3SL50F484C4LG vs EP3SE50F484C4LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F484C4LG disebabkan oleh Intel dan EP3SE50F484C4LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL50F484C4LG | EP3SE50F484C4LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Series | Stratix III L | — |
| Family | FPGA - Field Programmable Gate Array | Stratix® III E |
| Number of Logic Elements (LE) | 47500 | — |
| Number of LABs/CLBs | 1900 | — |
| Adaptive Logic Modules (ALM) | 19000 ALM | — |
| Total Embedded Memory | 2184192 bit (2.08 Mbit) | — |
| Number of I/O | 296 | — |
| Tegangan Pemberi Arus | 0.86 V to 1.15 V (1.1 V typical) | — |
| Suhu Operasi | 0 C to +85 C (TJ) | — |
| Gaya Pemasangan | SMD/SMT | — |
| Kemasan | 484-FBGA (23x23 mm) | 484-Ball FCBGA, 23 x 23 mm |
| Kemasan / Case | 484-BBGA, FCBGA | — |
| Packaging | Tray | — |
| Supplier Device Package | 484-FBGA | — |
| Status RoHS | Compliant | — |
| Speed Grade | C4 (commercial, slowest) | -4 |
| Process Node | 40 nm | 40 nm TSMC |
| Logic Elements | — | 47,500 LE |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Embedded Memory | — | 5.49 Mbit (2,886 Kbit M9K + M144K blocks) |
| Maximum User I/O | — | 296 |
| Hardware Multipliers (18x18) | — | 384 |
| PLLs | — | 4 |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Gambaran Suhu Operasi | — | 0°C to +85°C (Commercial) |
| Jenis Pemasangan | — | Surface Mount |
| Lead-Free / RoHS | — | Yes (lead-free finish, RoHS compliant) |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |
| Design Software | — | Quartus II 11.0 or later |