EP3SL50F484C4N vs EP3SL50F484I3 Perbandingan
Perbandingan bersamaan detil EP3SL50F484C4N dari Intel dan EP3SL50F484I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL50F484C4N | EP3SL50F484I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III L | — |
| Family | Altera/Intel Stratix III | Stratix III L (Low Power) |
| Logic Elements | 47,500 | — |
| Embedded Memory (bits) | 2,184,192 | 2,184,192 |
| Maximum User I/Os | 296 | — |
| Total RAM Bits | 2,184,192 | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Internal Operating Frequency | up to 717 MHz | 500 MHz |
| Speed Grade | C4 | — |
| Suhu Kerja | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (commercial) |
| Package Type | 484-ball FC-FBGA (FBGA-484) | — |
| Lead-Free Status | Yes (Pb-free) | — |
| Configuration Mode | AS / PS / JTAG | — |
| Status RoHS | Compliant | — |
| Device Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Maximum User I/O | — | 296 |
| Paket | — | 484-ball FC-FBGA (Flip-Chip FineLine BGA) |
| Tipe Mounting | — | Surface Mount |
| Lead-Free / RoHS | — | [DATA_NEEDED: lead-free/RoHS status] |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Configuration Scheme | — | SRAM-based (volatile, requires external config device) |
| Transceivers | — | Stratix III L — supports high-speed serial transceivers per family datasheet |