EP3SL50F484C4N vs EP3SL50F484I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F484C4N disebabkan oleh Intel dan EP3SL50F484I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL50F484C4N | EP3SL50F484I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III L | — |
| Family | Altera/Intel Stratix III | Stratix III L (Low Power) |
| Logic Elements | 47,500 | — |
| Embedded Memory (bits) | 2,184,192 | 2,184,192 |
| Maximum User I/Os | 296 | — |
| Total RAM Bits | 2,184,192 | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Internal Operating Frequency | up to 717 MHz | 500 MHz |
| Speed Grade | C4 | — |
| Suhu Operasi | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (commercial) |
| Package Type | 484-ball FC-FBGA (FBGA-484) | — |
| Lead-Free Status | Yes (Pb-free) | — |
| Configuration Mode | AS / PS / JTAG | — |
| Status RoHS | Compliant | — |
| Device Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Maximum User I/O | — | 296 |
| Kemasan | — | 484-ball FC-FBGA (Flip-Chip FineLine BGA) |
| Jenis Pemasangan | — | Surface Mount |
| Lead-Free / RoHS | — | [DATA_NEEDED: lead-free/RoHS status] |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Configuration Scheme | — | SRAM-based (volatile, requires external config device) |
| Transceivers | — | Stratix III L — supports high-speed serial transceivers per family datasheet |