EP3SL50F484C4N vs EP3SL50F484I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F484C4N sa pamamagitan ng Intel at EP3SL50F484I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL50F484C4N | EP3SL50F484I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | Stratix III L | — |
| Family | Altera/Intel Stratix III | Stratix III L (Low Power) |
| Logic Elements | 47,500 | — |
| Embedded Memory (bits) | 2,184,192 | 2,184,192 |
| Maximum User I/Os | 296 | — |
| Total RAM Bits | 2,184,192 | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Internal Operating Frequency | up to 717 MHz | 500 MHz |
| Speed Grade | C4 | — |
| Temperature na Operasyon | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (commercial) |
| Package Type | 484-ball FC-FBGA (FBGA-484) | — |
| Lead-Free Status | Yes (Pb-free) | — |
| Configuration Mode | AS / PS / JTAG | — |
| Tindminan RoHS | Compliant | — |
| Device Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Maximum User I/O | — | 296 |
| Packhaging | — | 484-ball FC-FBGA (Flip-Chip FineLine BGA) |
| Uri ng Pagpapasok | — | Surface Mount |
| Lead-Free / RoHS | — | [DATA_NEEDED: lead-free/RoHS status] |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Configuration Scheme | — | SRAM-based (volatile, requires external config device) |
| Transceivers | — | Stratix III L — supports high-speed serial transceivers per family datasheet |