EP3SL50F780C2N vs EP3SL50F780C3 Perbandingan

Perbandingan bersamaan detil EP3SL50F780C2N dari Intel dan EP3SL50F780C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SL50F780C2N EP3SL50F780C3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Waktu Pembelian Terakhir
Series Stratix III L Stratix III
Device Type FPGA (Field Programmable Gate Array) —
Logic Elements 47,500 47,500
Configurable Logic Blocks (LABs) 1,900 —
Embedded Memory 2,184,192 bits —
User I/Os 488 488
Paket 780-ball FBGA (FCBGA) —
Internal Fabric Frequency (max) 800 MHz —
Process Technology 65 nm —
Core Supply Voltage 0.9 V —
Speed Grade C2 3
Suhu Kerja 0 °C to 85 °C (Commercial) 0C to +85C (Commercial)
Tipe Mounting Surface Mount —
Status RoHS Compliant Compliant
Status Lingkungan Hidup Not Recommended for New Designs (NRND) —
Family — Stratix III L (low-power)
Logic Array Blocks (LABs) — 1,900
Embedded Memory Bits — 2,184,192
Package Type — 780-BBGA, FCBGA (FineLine)
Device Pin Count — 780
Supply Voltage (Core) — [DATA_NEEDED: VCCINT nominal value]
PLLs — 12
Global Clock Networks — 24
Process Node — 65 nm TSMC
Configuration Method — SRAM-based, supports Partial Reconfiguration
Lead-Free / Halogen-Free — Lead-Free (per package marking); Halogen-Free status unknown
Tingkat Sensitivitas Kekeringan (MSL) — MSL3 (per JEDEC J-STD-020, typical for large FBGA)

Spek dan Sumber

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