EP3SL50F780C2N vs EP3SL50F780C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F780C2N disebabkan oleh Intel dan EP3SL50F780C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SL50F780C2N | EP3SL50F780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Series | Stratix III L | Stratix III |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Logic Elements | 47,500 | 47,500 |
| Configurable Logic Blocks (LABs) | 1,900 | — |
| Embedded Memory | 2,184,192 bits | — |
| User I/Os | 488 | 488 |
| Kemasan | 780-ball FBGA (FCBGA) | — |
| Internal Fabric Frequency (max) | 800 MHz | — |
| Process Technology | 65 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Speed Grade | C2 | 3 |
| Suhu Operasi | 0 °C to 85 °C (Commercial) | 0C to +85C (Commercial) |
| Jenis Pemasangan | Surface Mount | — |
| Status RoHS | Compliant | Compliant |
| Status Lingkungan Hidup | Not Recommended for New Designs (NRND) | — |
| Family | — | Stratix III L (low-power) |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory Bits | — | 2,184,192 |
| Package Type | — | 780-BBGA, FCBGA (FineLine) |
| Device Pin Count | — | 780 |
| Supply Voltage (Core) | — | [DATA_NEEDED: VCCINT nominal value] |
| PLLs | — | 12 |
| Global Clock Networks | — | 24 |
| Process Node | — | 65 nm TSMC |
| Configuration Method | — | SRAM-based, supports Partial Reconfiguration |
| Lead-Free / Halogen-Free | — | Lead-Free (per package marking); Halogen-Free status unknown |
| Tingkat sensitiviti Air Nama (MSL) | — | MSL3 (per JEDEC J-STD-020, typical for large FBGA) |