EP3SL50F780C3G vs EP3SL50F780C3 Perbandingan

Perbandingan bersamaan detil EP3SL50F780C3G dari Intel dan EP3SL50F780C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SL50F780C3G EP3SL50F780C3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Waktu Pembelian Terakhir
Family Stratix III L Stratix III L (low-power)
Logic Elements (LE) 47,500 —
Adaptive Logic Modules (ALM) 19,000 —
Embedded Memory (bits) 2,184,192 —
Distributed RAM 2.08 Mbit —
User I/O Count 488 —
Core Voltage 1.1 V —
Suhu Kerja 0C to +85C (commercial) 0C to +85C (Commercial)
Temperature Grade Suffix C (commercial, "3" speed grade) —
Paket 780-ball FBGA —
Tipe Mounting SMD/SMT —
Packaging Tray —
Process Technology TSMC 40 nm low-power —
Configuration Method SRAM-based, JTAG/AS configuration SRAM-based, supports Partial Reconfiguration
Design Software Intel Quartus II (v9.0+) —
Status RoHS Compliant (per DigiKey listing) Compliant
Series — Stratix III
Logic Elements — 47,500
Logic Array Blocks (LABs) — 1,900
Embedded Memory Bits — 2,184,192
User I/Os — 488
Package Type — 780-BBGA, FCBGA (FineLine)
Device Pin Count — 780
Speed Grade — 3
Supply Voltage (Core) — [DATA_NEEDED: VCCINT nominal value]
PLLs — 12
Global Clock Networks — 24
Process Node — 65 nm TSMC
Lead-Free / Halogen-Free — Lead-Free (per package marking); Halogen-Free status unknown
Tingkat Sensitivitas Kekeringan (MSL) — MSL3 (per JEDEC J-STD-020, typical for large FBGA)

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