EP3SL50F780C3G vs EP3SL50F780C3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780C3G sa pamamagitan ng Intel at EP3SL50F780C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL50F780C3G EP3SL50F780C3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Huling Pagbili
Family Stratix III L Stratix III L (low-power)
Logic Elements (LE) 47,500 —
Adaptive Logic Modules (ALM) 19,000 —
Embedded Memory (bits) 2,184,192 —
Distributed RAM 2.08 Mbit —
User I/O Count 488 —
Core Voltage 1.1 V —
Temperature na Operasyon 0C to +85C (commercial) 0C to +85C (Commercial)
Temperature Grade Suffix C (commercial, "3" speed grade) —
Packhaging 780-ball FBGA —
Uri ng Pagpapasok SMD/SMT —
Packaging Tray —
Process Technology TSMC 40 nm low-power —
Configuration Method SRAM-based, JTAG/AS configuration SRAM-based, supports Partial Reconfiguration
Design Software Intel Quartus II (v9.0+) —
Tindminan RoHS Compliant (per DigiKey listing) Compliant
Series — Stratix III
Logic Elements — 47,500
Logic Array Blocks (LABs) — 1,900
Embedded Memory Bits — 2,184,192
User I/Os — 488
Package Type — 780-BBGA, FCBGA (FineLine)
Device Pin Count — 780
Speed Grade — 3
Supply Voltage (Core) — [DATA_NEEDED: VCCINT nominal value]
PLLs — 12
Global Clock Networks — 24
Process Node — 65 nm TSMC
Lead-Free / Halogen-Free — Lead-Free (per package marking); Halogen-Free status unknown
Level ng Sensitivity sa Asid ng Moisture (MSL) — MSL3 (per JEDEC J-STD-020, typical for large FBGA)

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