EP3SL70F780C4 vs EP3SL70F780I3 Perbandingan
Perbandingan bersamaan detil EP3SL70F780C4 dari Intel dan EP3SL70F780I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SL70F780C4 | EP3SL70F780I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Waktu Pembelian Terakhir |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Embedded Memory Bits | 2,699,264 bits | 2,699,264 bits |
| User I/O Count | 488 | — |
| LABs/CLBs | 2700 | — |
| Paket | 780-BBGA, FCBGA (FBGA-780) | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Jumlah Pin | 780 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 1.1 V |
| Speed Grade | C4 | I3 (industrial) |
| Suhu Kerja | 0 C to 85 C (Commercial TJ) | -40 C to +100 C (Industrial) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Number of Logic Elements / Cells | 67500 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Status RoHS | Compliant (per distributor listing) | [DATA_NEEDED: RoHS status] |
| Maximum User I/O | — | 488 |
| Process Node | — | 65 nm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |