EP3SL70F780C4 vs EP3SL70F780I3 比較
詳細並排比較 EP3SL70F780C4 由 Intel 與 EP3SL70F780I3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SL70F780C4 | EP3SL70F780I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 最後購買 |
| Series | Stratix III L | — |
| Family | Stratix III | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Embedded Memory Bits | 2,699,264 bits | 2,699,264 bits |
| User I/O Count | 488 | — |
| LABs/CLBs | 2700 | — |
| 封裝 | 780-BBGA, FCBGA (FBGA-780) | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| 腳位數 | 780 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | 1.1 V |
| Speed Grade | C4 | I3 (industrial) |
| 工作溫度 | 0 C to 85 C (Commercial TJ) | -40 C to +100 C (Industrial) |
| 安裝類型 | Surface Mount | Surface Mount |
| Number of Logic Elements / Cells | 67500 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| RoHS 狀態 | Compliant (per distributor listing) | [DATA_NEEDED: RoHS status] |
| Maximum User I/O | — | 488 |
| Process Node | — | 65 nm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |