EP3SL70F780I3N vs EP3SL70F780I4L Perbandingan
Perbandingan bersamaan detil EP3SL70F780I3N dari Intel dan EP3SL70F780I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL70F780I3N | EP3SL70F780I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Embedded Memory (bits) | 2,699,264 | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V (1.05 V to 1.15 V) | — |
| Operating Frequency | 500 MHz | — |
| Speed Grade | I3 (industrial) | I4 |
| Package Type | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) | — |
| Ball Pitch | 1.0 mm | — |
| Suhu Hubung Kerja | -40 C to +100 C | — |
| Configuration | SRAM-based, volatile | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant (per distributor listings) | Compliant |
| Embedded Memory Bits | — | 2,699,264 |
| User I/O Pins | — | 488 |
| Paket | — | 780-ball FBGA (FineLine BGA) |
| Suhu Kerja | — | -40C to +100C (industrial) |
| Power Variant | — | L (low static power) |
| Process Node | — | 40 nm |
| Configuration Method | — | Serial / Parallel / JTAG via Quartus II |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | None (logic/transceiver-less L variant) |
| PLL Count | — | [DATA_NEEDED: PLL count] |