EP3SL70F780I3N vs EP3SL70F780I4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780I3N sa pamamagitan ng Intel at EP3SL70F780I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F780I3N | EP3SL70F780I4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| Embedded Memory (bits) | 2,699,264 | — |
| User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V (1.05 V to 1.15 V) | — |
| Operating Frequency | 500 MHz | — |
| Speed Grade | I3 (industrial) | I4 |
| Package Type | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) | — |
| Ball Pitch | 1.0 mm | — |
| Temperature ng Junction na Operasyon | -40 C to +100 C | — |
| Configuration | SRAM-based, volatile | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (per distributor listings) | Compliant |
| Embedded Memory Bits | — | 2,699,264 |
| User I/O Pins | — | 488 |
| Packhaging | — | 780-ball FBGA (FineLine BGA) |
| Temperature na Operasyon | — | -40C to +100C (industrial) |
| Power Variant | — | L (low static power) |
| Process Node | — | 40 nm |
| Configuration Method | — | Serial / Parallel / JTAG via Quartus II |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | None (logic/transceiver-less L variant) |
| PLL Count | — | [DATA_NEEDED: PLL count] |