EP4CE55F23C8N vs EP4CE55F23C9L Perbandingan
Perbandingan bersamaan detil EP4CE55F23C8N dari Intel dan EP4CE55F23C9L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE55F23C8N | EP4CE55F23C9L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 LE | — |
| Embedded Memory | 2,340 Kbit (M9K blocks) | 2,396,160 bits (2.5 Mbit) |
| Embedded Multipliers | 156 (18x18) | — |
| Maximum User I/O Pins | 324 | — |
| Paket | 484-ball FBGA (F23) | 484-ball FBGA (F23) |
| Process Technology | 60 nm low-power CMOS | — |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Suhu Kerja | 0 C to +85 C (Commercial, C8) | -40C to +85C (industrial) |
| Speed Grade | 8 (Commercial) | C9 (fastest commercial/industrial) |
| PLLs | 4 general-purpose | 4 |
| Global Clock Networks | 20 | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant (Pb-free) | Compliant |
| Lead-Free Finish | Yes (N suffix) | — |
| Logic Elements (LE) | — | 55,856 |
| Embedded 18x18 Multipliers | — | 156 |
| User I/Os | — | 324 |
| Process Node | — | 60 nm low-power |
| Configuration Method | — | SRAM-based, requires external flash |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |