EP4CE55F23C8N vs EP4CE55F23C9L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F23C8N sa pamamagitan ng Intel at EP4CE55F23C9L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F23C8N | EP4CE55F23C9L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 LE | — |
| Embedded Memory | 2,340 Kbit (M9K blocks) | 2,396,160 bits (2.5 Mbit) |
| Embedded Multipliers | 156 (18x18) | — |
| Maximum User I/O Pins | 324 | — |
| Packhaging | 484-ball FBGA (F23) | 484-ball FBGA (F23) |
| Process Technology | 60 nm low-power CMOS | — |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Temperature na Operasyon | 0 C to +85 C (Commercial, C8) | -40C to +85C (industrial) |
| Speed Grade | 8 (Commercial) | C9 (fastest commercial/industrial) |
| PLLs | 4 general-purpose | 4 |
| Global Clock Networks | 20 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (Pb-free) | Compliant |
| Lead-Free Finish | Yes (N suffix) | — |
| Logic Elements (LE) | — | 55,856 |
| Embedded 18x18 Multipliers | — | 156 |
| User I/Os | — | 324 |
| Process Node | — | 60 nm low-power |
| Configuration Method | — | SRAM-based, requires external flash |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |