EP4CE55F23C8N vs EP4CE55F23C9L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE55F23C8N disebabkan oleh Intel dan EP4CE55F23C9L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE55F23C8N | EP4CE55F23C9L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements | 55,856 LE | — |
| Embedded Memory | 2,340 Kbit (M9K blocks) | 2,396,160 bits (2.5 Mbit) |
| Embedded Multipliers | 156 (18x18) | — |
| Maximum User I/O Pins | 324 | — |
| Kemasan | 484-ball FBGA (F23) | 484-ball FBGA (F23) |
| Process Technology | 60 nm low-power CMOS | — |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Suhu Operasi | 0 C to +85 C (Commercial, C8) | -40C to +85C (industrial) |
| Speed Grade | 8 (Commercial) | C9 (fastest commercial/industrial) |
| PLLs | 4 general-purpose | 4 |
| Global Clock Networks | 20 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant (Pb-free) | Compliant |
| Lead-Free Finish | Yes (N suffix) | — |
| Logic Elements (LE) | — | 55,856 |
| Embedded 18x18 Multipliers | — | 156 |
| User I/Os | — | 324 |
| Process Node | — | 60 nm low-power |
| Configuration Method | — | SRAM-based, requires external flash |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |