EP4CE55F29I8L vs EP4CE55F29I8LN Perbandingan
Perbandingan bersamaan detil EP4CE55F29I8L dari Intel dan EP4CE55F29I8LN dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE55F29I8L | EP4CE55F29I8LN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Device Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 bits | — |
| Embedded 18x18 Multipliers | 156 | — |
| Maximum User I/Os | 374 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Logic Array Blocks (LABs) | 3,435 | 3,135 |
| Process Technology | 60 nm low-power | 60 nm TSMC low-power |
| Core Voltage VCCINT | 1.0 V / 1.2 V | — |
| Auxiliary Voltage VCCAUX | 2.5 V | — |
| I/O Voltage VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Paket | 780-FBGA (FineLine BGA), 29x29 mm | 780-ball FBGA (F29) |
| Operating Temperature (Industrial) | -40C to +100C junction | — |
| Speed Grade | 8 | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, Active Serial, JTAG | JTAG, AS, PS, FPP |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | — |
| Device Model | — | EP4CE55 |
| Logic Elements (LEs) | — | 55,856 |
| Total Embedded Memory Bits | — | 2,396,160 bits |
| Embedded Memory (M9K blocks) | — | 260 blocks |
| 18x18 Hardware Multipliers | — | 374 |
| Maximum User I/O Pins | — | 374 |
| Core Voltage | — | 1.2 V |
| Ball Pitch | — | 1.0 mm |
| Suhu Kerja | — | -40C to +85C (Industrial) |
| Lead-Free / RoHS | — | Yes (per OPN suffix N) |
| Supported I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |