EP4CE55F29I8L vs EP4CE55F29I8LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F29I8L sa pamamagitan ng Intel at EP4CE55F29I8LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F29I8L | EP4CE55F29I8LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Cyclone IV E |
| Device Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 bits | — |
| Embedded 18x18 Multipliers | 156 | — |
| Maximum User I/Os | 374 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Logic Array Blocks (LABs) | 3,435 | 3,135 |
| Process Technology | 60 nm low-power | 60 nm TSMC low-power |
| Core Voltage VCCINT | 1.0 V / 1.2 V | — |
| Auxiliary Voltage VCCAUX | 2.5 V | — |
| I/O Voltage VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Packhaging | 780-FBGA (FineLine BGA), 29x29 mm | 780-ball FBGA (F29) |
| Operating Temperature (Industrial) | -40C to +100C junction | — |
| Speed Grade | 8 | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, Active Serial, JTAG | JTAG, AS, PS, FPP |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | — |
| Device Model | — | EP4CE55 |
| Logic Elements (LEs) | — | 55,856 |
| Total Embedded Memory Bits | — | 2,396,160 bits |
| Embedded Memory (M9K blocks) | — | 260 blocks |
| 18x18 Hardware Multipliers | — | 374 |
| Maximum User I/O Pins | — | 374 |
| Core Voltage | — | 1.2 V |
| Ball Pitch | — | 1.0 mm |
| Temperature na Operasyon | — | -40C to +85C (Industrial) |
| Lead-Free / RoHS | — | Yes (per OPN suffix N) |
| Supported I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |