EP4CE75F29C8L vs EP4CE75F29I8L Perbandingan
Perbandingan bersamaan detil EP4CE75F29C8L dari Intel dan EP4CE75F29I8L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE75F29C8L | EP4CE75F29I8L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Logic Elements (LE) | 75,408 | 75,408 |
| Configurable Logic Blocks (CLBs) | 4,713 | 4,713 |
| Embedded Memory | 2,810,880 bits (426 Kbits M9K blocks) | — |
| Embedded Multipliers (18x18) | 426 | — |
| General-Purpose I/O Pins | 426 (max) | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | 15 |
| Process Technology | 60 nm low-power CMOS | 60 nm low power CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Voltage (VCCA) | 2.5 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Speed Grade | C8 (commercial, 8 speed bin) | 8 |
| Suhu Kerja | 0C to 85C (commercial) | — |
| Paket | FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch) | 780-ball FBGA (F29) 29x29 mm, 1.0 mm pitch |
| Ball Count | 780 | — |
| Tipe Mounting | Surface Mount | — |
| Status RoHS | Compliant (lead-free) | Compliant |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Device Family | — | Cyclone IV E |
| Embedded Memory (bits) | — | 2,810,880 |
| Embedded 18x18 Multipliers | — | 274 |
| Maximum User I/O | — | 426 |
| General-Purpose PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Internal Operating Frequency (max) | — | 362 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C junction) |
| Configuration Memory | — | SRAM-based, requires external configuration device |