EP4CE75F29C8L vs EP4CE75F29I8L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE75F29C8L disebabkan oleh Intel dan EP4CE75F29I8L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE75F29C8L | EP4CE75F29I8L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Logic Elements (LE) | 75,408 | 75,408 |
| Configurable Logic Blocks (CLBs) | 4,713 | 4,713 |
| Embedded Memory | 2,810,880 bits (426 Kbits M9K blocks) | — |
| Embedded Multipliers (18x18) | 426 | — |
| General-Purpose I/O Pins | 426 (max) | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | 15 |
| Process Technology | 60 nm low-power CMOS | 60 nm low power CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Voltage (VCCA) | 2.5 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Speed Grade | C8 (commercial, 8 speed bin) | 8 |
| Suhu Operasi | 0C to 85C (commercial) | — |
| Kemasan | FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch) | 780-ball FBGA (F29) 29x29 mm, 1.0 mm pitch |
| Ball Count | 780 | — |
| Jenis Pemasangan | Surface Mount | — |
| Status RoHS | Compliant (lead-free) | Compliant |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Device Family | — | Cyclone IV E |
| Embedded Memory (bits) | — | 2,810,880 |
| Embedded 18x18 Multipliers | — | 274 |
| Maximum User I/O | — | 426 |
| General-Purpose PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Internal Operating Frequency (max) | — | 362 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C junction) |
| Configuration Memory | — | SRAM-based, requires external configuration device |