EP4CE75F29I7 vs EP4CE75F29I7N Perbandingan
Perbandingan bersamaan detil EP4CE75F29I7 dari Intel dan EP4CE75F29I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE75F29I7 | EP4CE75F29I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone IV E | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LEs) | 75,408 | — |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 |
| Embedded Memory Blocks | 274 (M9K) | — |
| Embedded 18×18 Multipliers | 200 | — |
| PLLs | 4 | 4 |
| User I/O Count | 426 | — |
| Paket | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (F29) |
| Suhu Kerja | -40 °C to +100 °C (Industrial) | -40C to +100C (Industrial) |
| Process Node | 60 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.0 V / 1.2 V selectable | — |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| External Memory Interfaces | DDR/DDR2 SDRAM, QDRII SRAM | — |
| Status RoHS | Compliant | Compliant |
| Level MSL | 3 (168 hours) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Family | — | Cyclone IV E |
| Logic Elements (LE) | — | 75,408 |
| Logic Array Blocks (LAB) | — | 4,633 |
| Embedded 18x18 Multipliers | — | 426 |
| Global Clocks | — | 20 |
| Maximum User I/O Pins | — | 426 |
| I/O Banks | — | 8 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 60 nm low-k |